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ASMPT Limited

Singapore · HKEX: 0522.HK · Market cap: · P/E: · P/S:

ASMPT sells the machines and software that chipmakers and electronics factories use to assemble and package chips and circuit boards.

ASMPT makes the machines that turn bare silicon chips into finished parts you can actually use. A chip fresh off a wafer is tiny, fragile, and has no wires attached. Someone has to glue it down, connect it with microscopic wires or solder bumps, seal it in plastic, and test it — all at incredible speed and precision. ASMPT builds the equipment that does this work, along with the surface-mount technology (SMT) machines that place components onto circuit boards.

ASMPT Limited (0522.HK) Thermo-Compression Bonding (TCB) advanced packaging equipment: line art illustration of a large thermo-compression bonding machine with heated bonding head pressing a chip onto a substrate
Thermo-Compression Bonder
TCB machines bond chips to substrates with heat and pressure for advanced packaging.

The company sells to two broad groups of customers. Chipmakers and outsourced assembly-and-test factories buy its semiconductor assembly tools, which handle steps like wire bonding, die attach, and advanced packaging. Electronics manufacturers buy its SMT placement machines, which pick up components and press them onto boards. ASMPT also sells software and materials that tie the whole process together, including products for advanced packaging used in AI chips. Its home base is Singapore, and it is one of the few big equipment makers that straddles both chip packaging and board assembly. Customers choose ASMPT because advanced packaging has become a bottleneck in the AI boom — stacking and connecting chips is now as important as making them small. Its rivals include KLA and Applied Materials in process control and equipment, plus BE Semiconductor Industries in advanced packaging, though ASMPT's edge is that it covers many steps rather than just one.


The business is cyclical and tied to chipmakers' spending mood, which swings hard. Orders surged during the AI buildout, especially for its advanced packaging tools, but the SMT side has been softer as general electronics demand cooled. ASMPT has been investing in R&D and has made acquisitions to strengthen its advanced packaging offerings, betting that the complicated job of connecting chips together stays in demand. When orders are strong, the company generates solid cash and pays a dividend; when the cycle turns, investors get reminded that selling shovels to chipmakers is a feast-or-famine trade.

Saved answer · last researched 14 Nov 2026